Micron Diamond Plus

This new product line Micron Diamond – plus was uniquely designed to avoid special causes of
variation inherent in particle manufacturing. By a precise and non-traditional control of the grading
process, Warren/Amplex dramatically reduces adjusted center grading...effects.

The result is that Warren/Amplex maintains a higher degree of control over the full range of
particles. For example, traditional product specifications usually confine product tolerances to
mean volume (Mv), d10 and d90 or in some cases d95 of the distribution.

With the Micron Diamond -plus product line, tighter limits are placed on the d50 (median) d10
and d99 of the distribution. This innovative approach yields a particle distribution that has a higher
degree of accuracy and repeatability in terms of the middle of the distribution (median) d50, fine
end (d10) and coarse end (d99). Click HERE for comparison chart.

Machining applications which demand critical size and finish tolerances require MB - plus products.
Examples include silicon wafer grinding/slicing/dicing, sapphire and SiC ingot wire sawing, PMR/GMR
magnetic recording head polishing and prosthetics polishing.

The unique Micron Diamond – plus products consist of Metal Bond, Resin Bond and Polycrystalline types. Click HERE to see the available sizes.

For more information, contact Ron Abramshe